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48 Bi State Plaza #185
Old Tappan, New Jersey-07675, United States+(1)-201-7679543
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Single/Double Side
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Specifications: Laye : 1~2 Material: CEM-1, CEM-3, FR-1, FR-2, FR-4 Thickness: 0.4 ~ 1.6mm Cu(In/Ex): 1/2oz ~ 3Oz Finish: OSP, HASL, Gold Plating ... Read More
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Heavy Ounce Copper
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Specifications: Layer : 4 ~ 24 Material : FR4, FR5 Thickness : 0.6 ~ 3.2mm Cu(In/Ex) : 1/2 ~ 2Oz Finish : HASL, Gold Plating Min Hole : ... Read More
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Multilayer Boards
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Multilayer Boards
Specifications: Laye : 4~44 Material: FR4, High Tg Fr4 Thickness: 0.4t~4.7t Cu(In/Ex: 3oz/3oz Finish: Immersion Gold, HAL Min Hole: 0.2mm
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Flexible Circuit
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Flexible Circuit
Specifications: Laye: 1 ~ 10 Material: Polyimide Thickness: 0.1 ~ 2.4mm Cu(In/Ex): 1/2 ~ 1oz Finish: Tin plating, Gold Plating Min Hole: 0.3mm
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Metal Based
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Metal Based
Specifications: Layer : 1 ~ 2 Material : FR4+Metal Thickness : 1.0 ~3.2t Cu(In/Ex) : 1/2 ~ 2Oz Finish : HASL, Gold Plating Min Hole :0.2mm
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Silver Through Hole
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Silver Through Hole
Specifications: Layer : 2L Material : CEM3 Thickness : 1.6t Cu(In/Ex) : 1/2oz Finish : OSP Min Hole :0.5mm
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Teflon
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Teflon
Specifications: Layer : 2L Material : PTFE Thickness : 1.6t Cu(In/Ex) : 1oz Finish : HASL Min Hole :0.2mm
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Back Panel
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Back Panel
Specifications: Layer : 2~44 Material : FR4, High Tg FR4l Thickness : 0.8 ~ 7mm Cu(In/Ex) : 1/2~2Oz Finish : HASL, Gold
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Build Up
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Build Up
Specifications: Layer : 4 ~ 24 Material : FR4, FR5 Thickness : 0.6 ~ 3.2mm Cu(In/Ex) : 1/2 ~ 2Oz Finish : HASL, Gold Plating Min Hole : 0.2mm
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Blind Via Holes
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Blind Via Holes
Specifications: Layer : 8L Material : FR4 Thickness : 1.6t Cu(In/Ex) : 1/2o Finish : Immersion Gold Min Hole : 0.2mm
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Rigid Flexible
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Rigid Flexible
Specifications: Layer: 6L Rigid flex Material: FR4+ Polyimide Thickness: 0.8 2t Cu(In/Ex): 1/2oz Finish: Tin plating Min Hole: 0.3mm
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