MATERIALTypeCEM1 (Standard), CEM3, FR4 Thicknessfrom 1,0mm - 1,55mm Copper35 Micron (standard) Carbon resistance100 Ohm/sq/25 ( standard) +-20% Printed carbon thicknessfrom 10micron AplicationPotentiometer Optimum panel size405,00mm x 533,00mm CNC MACHININGDrillingmin hole 0,40mm Routingmin routing slot 0,80mm V-cutmax Thicknes 3,50mm MASS PRODUCTIONPunchingPush out or Push back min hole 0,9mm0,9mm Min Slot pinching0,9mm Min Slot (routing)0,80mm ETCH RESISTfinemass productionMin Track0,20mm0,30mmTrack to Track0,20mm0,30mmTrack to Pad0,35mm0,40mmDrill to Pad0,30mm0,40mmMin Pad0,20mm0,30mmCu to Border (V-Cut)0,30mm0,30mmCu to Border (routing)0,20mm0,20mm.
Materialtypecem1 (standard), cem3, fr4, fr2 thickness from 1,0mm 1,55mm copper35 micron (standard) carbon resistance10 ohm/sq/25 (standard) silver resistance below 1 ohm/sq/25 printed carbon thickness from 10 micron printed silver thickness from 10 micron cnc machining drilling min hole 0,40mm routing min routing slot 0,80mm v-cutmax material thickness 3,50mm mass production punchingpush out or push back min hole 0,9mm0,9mm min slot punching0,9mm min slot punching (routing)0,80mm etch resist finemass production min track0,20mm0,30mmtrack to track0,20mm0,30mm.
Material type thermal conductivity ims insulated metal core al2w/mk5w/mk thermal cem31w/mk thermal fr41w/mk cu thicknes35 micron (standard) 70micronpossible double side dielectric thickness 75micron to 150micron 100 micron(standard) CNC machining drilling min hole 1,0mm routing min routing slot 1,2mm v-cut max material thickness 3,50mm, min core 0,3mm (standard) mass production punching push out min hole 1,0mm0,9mm min slot punching1,0mm etch resist fine mass production min track0,20mm0,30mmtrack to track0,20mm0,30mmtrack to pad0,35mm0,40mmdrill to pad0,30mm0,40mmmin pad0,20mm0,30mmcu to border (v-cut)0,30mm0,30mmcu to border (routing)0,20mm0,20mmsolder maskuv green, white, black. Min pad to mask 0,15mmlegend printuv black, white, …min line 0,15mmelectrical testbed of nails (grid 2. 54) special inkpeelable mask pad to solder mask (solder mask offset)0,15mm pad to pad (with solder mask between)0,50mm.
Ionocom offers design of printed circuit boards as part of the product development process. We can also offer this as a standalone service. Our ...view details
printed circuit board assembly from smt, through hole to complex mixed technology. new product desgin - rb manufacturing can design and development ...view details
A customer in the network communications industry needed a company with the experience and resources to assemble their printed circuit board to ...view details
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