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Dymatix - Achievements

DYMATiX was formed on January 1, 2000, through the consolidation of Viking Semiconductor Equipment and Ultracision. The two were combined to maximize the synergistic opportunities of people, technology and manufacturing.

Outlined below is a brief history of the Viking and Ultracision operations and products.

Viking was formed in 1983 producing singulators for lead frames. In 1985, the company expanded into optical inspection of sawn wafers with the introduction of the VIS-100.

Over the next two years, the 1010 and 2010 Die Demounters were developed for low-cost, high volume transfer of die from 4-inch to 8-inch film frames for manual sorting. With the success of the manual sort capabilities of the Demounters, Viking expanded into automatic sorting of delicate, high-value die from film frames to various die carriers. The first of these started with the 1040 in 1988, which was the foundation for a series of major developments extending over 12 years. The most significant of these developments were the following:

1990 HAL Wafer Mapping Wafer mapping for both visual and die sorting systems
1991 1042 Die Sort System Up to 150mm wafers, film frame to film frame, and film frame to waffle pack or grip ring; die inversion
1991 1061/1062 Die Bonder Chip bonding from 200mm wafers to a variety of package types
1995 1044 Die Sort System Up to 200mm wafers, film frame to film frame or waffle pack, waffle pack to film frame
1998 1046 Tape & Reel/Die Sort System Up to 200mm wafers, film frame to tape, film frame to waffle packs/Jedec trays, die inversion, die rotation
2000 1046 Enhancements 2-D bump and BGA inspection, Jedec tray/waffle pack stacker, CE compliance

To date, over 1,000 systems have been shipped to semiconductor customers in Asia, Europe and North America.

Ultracision was founded in 1984 with the design and manufacture of the modular Automation Control System (ACS-8) and the Polar III, three-axis coordinated robot. The company subsequently expanded into providing integrated cleanroom automation systems for wafer and hard-disk handling, testing and visual inspection applications.

In 1991, Ultracision purchased the Analytical Prober product line (formerly known as Rucker & Koll) from General Signal/Electroglas. This product line was upgraded to include 200mm capability, as well as all new electronics and software.

Over the years, the automation line added several technological enhancements, including the following:

1992 Edge-handling inspection gimbal assemblies for front/backside wafer inspection
1994 Edge-handling robotic end effectors and pre-aligners
1997 Material Processing System (MPS-NT) application software, UltraGem, SECSII/GEM interface option
1997 300mm edge-handling robotics
1998 300mm edge-handling inspection gimbal assemblies, pre-aligners

To date, more than 600 systems have been shipped in both the semiconductor and memory media (hard disk) industries. Systems are installed in Asia, Europe and North America.


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