Electron-Mec S.R.L.

Optimization of the wafer dicing process involves precise control of many variables that are both directly and indirectly affected by such properties as material hardness, brittleness, and thickness. As new wafer materials, such as gallium arsenide, lithium tantalite, and even copper, join the mix with standard silicon, semiconductor manufacturers face new and greater challenges in maintaining and improving dicing productivity. ADT is developing ways to quantify and regulate dicing blade materials and characteristics, for the most favorable effect on cut quality, blade life and throughput. By combining this information with process parameters that have been 100% laboratory tested, solutions to these challenges are now easily obtainable.