Since 1977 these are the three rigid columns of our company culture. Paired with the strengths of a family managed enterprise which are lean structures and quick decisions we constantly enhanced our position in the market for printed circuit boards (PCB), multilayers, rigid/flex-circuits and flex-circuits, thick copper technology as well as HDI circuits and specialities. Today all relevant PCBs are produced using LDI (Laser Direct Imaging) technology and are then tested on highly sophisticated ...
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Buried und blind vias mechanical drilling 0,15mm plugging thick film copper technology up to 250 μm LDI (Laser Direct Imaging) ultrathin innerlayer up to 50 μm heatsinks Impedance control.




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