To tin plate the lead for better conductivity and avoid oxidation.
AEM, TECHNIC, PAL and STS
100% Pure Tin, 100% Pure tin with Nickel under layer and Tin Bismuth process.
* Pure tin plate for 2 lds to 28lds, 32lds, 40lds and 42lds Cerdip and Plastic molded packages.
* Fully automated. Loader from tube and reloaded into tube after plating process.
* Automatic Strip to Strip plating.
* Automatic Rack plating.
* Plating Thickness from 200u” to 800 u”
* CPK at 1.67
* Lead Frame width from 15mm to 60mm
Lead Frame Material (Base Metal):
Finished product plating on Copper, AL42 and Silver Plated Lead Frame
Penang and Kuala Lumpur.