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6 Yrs
Plot 2, Phase 4, Free Industrial Zone, Bayan Lepas, Penang
Bukit Mertajam, Pulau Pinang-11900, Malaysia+(60)-4-6444906
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Side Braze Saw

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Sawing Concept :
* Engineering wafer to cut a structure out for assembly and testing.
Criticalness Control on Sawing
* Understand saw plan and manually program performing sawing.
* Wafer thickness: thinnest down to 50 micron (2 mils)
* Saw street: as small as 0.8 mils
Sawing conditions capabilities:
* DI Water resistivity with CO2 bubbler <1M or >10M, RO, H2O2, Triton-X and Diamaflow.
Saw materials capabilities:
* Silicon, GaAs, Silicon Carbide, Copper wafers, Ceramic substrate and PCB.
Wastewater treatment capabilities:
Capacity 60 gpm
System Treatment
Treatment Plant rinse water from Plating Bath, Sawing & Scrubber Wafer materials : Silicon, GaAS, InGaN, Silicon Carbite.
Concentrate Areas Die and substrate Sawing STM Tin Plate & IDT Lines (Pump < 3,200litres/Month)
Operation 24hrs/day

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