It is the main compound for acid copper plating and the source of Cu2+In the plating solution. The JHD copper sulfate is processed so that metallic ions and organic impurities affecting the plating bath's perfomance can be removed effectively.
Due to its high quality and direct usability without treatment, it can be used for plastic plating, electroforming finishing, PCBs, electronic contacts, chemical copper plating, microelectronic interconnection technology and encapsulation.
The key to process stability is to select high-grade plating materials.
Density=2.2844g/cm3, Toxic; Metallic acerbity smell; the aqueous blue solution has weak acidic properties.
At 150 degrees centigrade, it loses its moisture and becomes a white powder (Copper sulfate anhydrous). At 650 degrees, it diffuses into copper oxide and sulfur trioxide.