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Hybrid 3D Interferometer

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K-MAC 3D profiler, OV-SPI 500, provides non-contact and non-destructive measurement thanks to White Light Scanning Interferometry. Due to CCD camera installation, the real-time measurement is possible and the measurement result is displayed with 3D mapping data through the perpendicular resolution of nano unit. Especially, the integrations with Thickness, Refractive index and Critical dimension measurements, the distinguished feature of OV-SPI 500, extends its possibility to apply wide range of applications.

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