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OSP Measurement

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ST4080-OSP is designed for measuring OSP(Organic Solderability Preservative) thickness on a Cu Substrate of PCB/PWB. As the non-destructive optical metrology using spectroscopic reflectometry, it provides the average thickness and detailed 3D Surface profile information allowing the real-time detection without any sample preparation.

ST4080-OSP is applicable to real-pattern on PCB substrate due to the very small measurement spot and the auto focusing function. ST4080-OSP is based-on K-MAC thickness measurement technology which reliability has been proven in semiconductor, flat panel display and other electronic materials industries.


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