K&S’ new AutoOLP software operates inside AutoCAD® using industry standard design techniques. In minimal time, you can increase the effectiveness of your wire bonders by converting die and package drawings into complex, precise bonder recipes.
Reduced Teach Time
AutoOLP guides operators through the program to ensure that critical process information is entered. Use of original device diagrams in an easy-to-use Windows® PC environment reduces bond program generation time. Higher Bonder Utilization AutoOLP operates on your standard PC, remote from the clean room. Your bonders remain fully productive. Programs can be transferred via network, or by diskette.