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Manual Wedge Bonder

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For process development, production, research or added manufacturing support, K&S 4500 Series Manual Wedge Bonding Systems provide the high yields and excellent repeatability needed for every gold ball bonding applications, including:

· Optoelectronic Modules
· Hybrid/MCMs
· Microwave Products
· Discrete Devices/Lasers
· Chip-on-Board

Semi-automatic and manual operation modes, individual bond parameter control, and capacity for a wide range of wire diameters enable ease of use in ball bonding, ball bumping, coining, security bonding and single-point TAB applications.

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