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Wedge Bonder

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The XDA Extra Deep Access Option for all K&S Manual Wedge Bonders, not only increases Z-axis clearance from the standard .500" to .750", but also expands the range of controllable Z-axis motion from .250" to .400". This feature provides additional versatility for a wider range of optical, microwave and complex hybrid/MCM applications, especially those that require precision wedge bonding in deep cavities or tight recesses where clearance and control are essential.

Wedge Bonder

Wedge Bonder

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The 7200Plus is designed specifically for the power semiconductor industry. Focusing on the needs and trends in this market allowed Orthodyne to engineer a bonder that excels at meeting today's packaging challenges. The 7200Plus has high productivity, process stability, low cost of ownership (COO) and the flexibility to grow with market demands.

The pluses built into the 7200Plus come from Orthodyne's experience and understanding of changing customer needs. Our commitment to outstanding performance, exceptional customer service and ongoing product development has made a better bonder even better.

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