Marco Group Investment Company Limited

PRODUCT DESCRIPTION RF-008T is formulated chemical product with a proprietary activator, a very active, low solids content, no clean flux with a small additon percentage or resin that enhanced thermal stability, while maintaining a high level of long-term electrical reliability.This special characteristic is good for copper and soldering layer surface wetting effect. After wave soldering, RF-008T leaves a low level of non-tacky residue, which is easily penetrable in pin testing. FEATURES & BENEFITS *Highly active for excellent soldering and low defect rates. *Low level of non-tacky residue to reduce interference with pin testing. *Cleaning is not required which reduces operating costs. *Reduces the surface tension between solder mask and solder to significantly reduce solder ball frequency. *Meets Bellcore requirements for long-term electrical reliability. APPLICATION GUIDELINES RF-008T is formulated chemical product to be applied by foam, wave or spray methods.The rosin flux spraying layer density and its evenness is the success key of its application. Recommend spraying layer density from 500 to 1500 mirco gram per square inch in order to maintain consistent soldering performance and electrical reliability. More important, it is to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness.The heating temperature is the key factor of all elements such as the conveyor speed, component or circuit board etc. During the wave soldering, the top side circuit board preheated temperature is 190 - 240F (88-115C) and the bottom side board preheated temperature is 250 - 325F (121 - 163C).