Pac Tech Usa Incorporated
328 Martin Avenue
Santa Clara, California-95050, USA
Santa Clara, California-95050, USA
+(1)-(408)-5881925
PAC TECH – Packaging Technologies GmbH, a group member of NAGASE & CO., Ltd., manufactures equipment for the microelectronic & advanced packaging industry and is the world’s leading wafer bumping and packaging subcontractor, specializing in electroless under-bump-metallization (UBM) and solder ball placement. PAC TECH is located in Nauen, Germany (HQ), and has 100% subsidiaries PAC TECH USA - Packaging Technologies Inc., in Silicon Valley, ...
read moreBUSINESS INFORMATION
Business Type
Trader
OTHER PRODUCTS
- Laser Solder Jetting System
- Plasma Clean And Etch System
- Megasonic Clean With Qdr And Wafer Handling System
- Laser Assembly System
- Optical Inspection System
PRODUCTS & SERVICES
PAC TECH offers subcontractor electroless nickel plating services for wafer bumping, pad resurfacing (wirebonding) and ...
read more
Automated coating system for wafers up to 12“. The coater is equipped with two hotplates for wafer curing/baking at ...
read more
The LS² - systems are used for laser marking of silicon wafers in wafer level packaging. LS² allows marking of ...
read moreRELATED CATALOGS
Industrial Temperature Sensors specializes in the manufacture of temperature sensors. A large variety of sensors for all industries such as ...
Here at New England Rubber our aim is to know what you need - even when you don't.Founded in 1977.We have an extensive inventory of Industrial Hose, ...
We believe you'll be glad you came. Sore hands or body pain can cause considerable discomfort and suffering for workers not to mention lost ...
Since the founding of Sasakura in 1949, we have been engaged in research and development of marine equipment, desalination plants, air-cooled heat ...
Language:
SEND ENQUIRY
