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1607, New East Ocean Centre, 9 Science Museum Road
Kowloon, Kowloon City-999077, China (Hong Kong S.A.R.)+(852)-775-83595858
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Flip Chip Bonding Machine

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For the laser diode attachment on the submount of various active photonic packages, we have equipped high precision die bonders with a placement accuracy of 5 microns or better. Moreover, to keep pace with the high growth photonic market, we have also equipped fully automated flip chip bonders
(ESEC Micron 2) with high throughput, high accuracy and high flexibility to suit for the high volume production demand.

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