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Flux Formulation

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Our technical expertise enables us to providing a comprehensive assortment of Flux Formulation which is use for high thermal stability and superior solderability; these products are highly valued in the industry due to its preservation stability. Offered products are processed by finest quality ingredients keeping in mind set industry norms.
Features:

  • Resin free
  • No residue after soldering
  • Very low solids

Other Details:

  • Fuji, Japan developed "Seal-glo NE series" adhesives for chip or SMD mounting machines
  • These are onepart thermo-setting epoxy adhesives with the property of preservation stability, and are of 1 to 2 minute short time or high speed curability required for 120 to 150°C heat-given SMD packaging
  • Our principals are ready, in addition, to offer the adhesives of various grades with excellent micro printability or with suitability for high-speed dispensers

Specifications:

Characteristics951981
Flux TypeLow Solids No-Clean“RMA” No-Clean
Product CharacteristicsVery low solids, resin free, practically no
residue after the soldering process
Designed for high thermal stability and
superior solderability. Military approved
formula for add-on and rework applications
Residue Removal MethodDesigned not to be cleaned. May be removed
with hot de-ionized water at 140-160°F or a 1%
solution of Kester’s Bio-Kleen # 5768
Residue is non-Corrosive. However, removal
is possible with solvent or a water wash containing
a 7% solution of Kester’s ® Bio-Kleen # 5768

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