Svcs Process Innovation

The design of the SVCS Low Pressure Chemical Vapor Deposition furnaces combines the multiple process capability with the needs of a maximum capacity for full production system (SVcFUR-FP) and high flexibility small scale versions for use in research and pilot production (SVcFUR-RD). It provides an easy-to-maintain, safe and reliable horizontal furnace platform. The SVCS design is outstanding for high efficiency, minimised footprint and low cost of ownership while offering high process flexibility. LPCVD Processes Silicon nitride Low temperature oxide (LTO) High temperature oxide (HTO) TEOS oxide Polysilicon, both with tilt and flat temperature profile Doped polysilicon Oxynitride