Syscon Tek Corporation
5f, No. 121, Chien 8th Road., Chung Ho City
Taipei-Hsien, Taiwan
Taipei-Hsien, Taiwan
+(886)-(2)-22235469
Housing, Wafer & Terminal
Pitch : .1" (2.54mm) No. of Contacts : 2 to 20 Contact Material : Copper Alloy Tin-Plated Insulator Material : Nylon 66 Glass Filled, UL 94V-0(2) Current Rating : 5 Amps Contact Resistance : 10m Max. Insulation Resistance : 1000M Min. Withstand Voltage : AC 1000V (1 Minute) Operating Temperature : -250C to + 850C Applocable Wires: AWG# 22-28
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Housing, Wafer & Terminal
Pitch : .156" (3.96mm) No. of Contacts : 2 to 20 Contact Material : Copper Alloy Tin-Plated Insulator Material : Nylon 66 Glass Filled, UL 94V-0(2) Current Rating : 5 Amps Contact Resistance : 10m Max. Insulation Resistance : 1000M Min. Withstand Voltage : AC 1000V (1 Minute) Operating Temperature : -250C to + 850C Applocable Wires: AWG# 18-22
More - Electronic Housings
Housing, Wafer & Terminal
Pitch : .156" (3.96mm) No. of Contacts : 2 to 20 Contact Material : Copper Alloy Tin-Plated Insulator Material : Nylon 66 Glass Filled, UL 94V-0(2) Current Rating : 3 Amps Contact Resistance : 10m Max. Insulation Resistance : 1000M Min. Withstand Voltage : AC 1500V (1 Minute) Operating Temperature : -250C to + 850C Applocable Wires: AWG# 18-22
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Housing, Wafer & Terminal
Pitch : .2" (5.08mm) No. of Contacts : 2 to 10 Contact Material : Copper Alloy Tin-Plated Insulator Material : Nylon Glass Filled, UL 94V-0 Current Rating : 5 Amps Contact Resistance : 10m Max. Insulation Resistance : 1000M Min. Withstand Voltage : AC 1000V (1 Minute) Operating Temperature : -250C to + 850C Applocable Wires: AWG# 18-22
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Housing, Wafer & Terminal
Pitch : .295" (7.5mm) / .197" (5.0mm) No. of Contacts : 2 to 10 Contact Material : Copper Alloy Tin-Plated Insulator Material : Nylon 66 Glass Filled, UL 94V-0(2) Current Rating : 5 Amps Contact Resistance : 10m Max. Insulation Resistance : 1000M Min. Withstand Voltage : AC 1000V (1 Minute) Operating Temperature : -250C to + 850C Applocable Wires: AWG# 18-22
More - Electronic Housings
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