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Plasma Spray Coating

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Tekna’s Induction plasma spray coating technology is a remarkable tool for achieving dense, high purity coatings. The axial feeding of the powder assures efficient melting and a high efficiency in the deposition process.

* High Density
* High Purity
* Near net shape deposition
* High melting temperature material
* Low or high velocity
* Controlled atmosphere
* Vacuum to positive pressure
Applications
Materials treated or created with induction plasma spray generate coatings which deliver solutions for applications ranging from electronics to biomedical . Coating applications requiring dense, thick and high purity materials can be classified as follows:
Sputtering and X-Ray Targets
Induction plasma spray coating technology is used for manufacturing or rebuilding critical components requiring a high-quality coating, such as sputtering or X-Ray targets.
Thees targets have long been manufactured through the use of different powder metallurgical techniques to form a target plate made of high purity material which is subsequently mounted on a target backing material for proper heat management under final operating conditions. The technique is relatively tedious and requires a number of steps for powder preparation and densification, followed by powder compaction at room temperature and subsequent sintering to the required high density material. In certain cases, room temperature compaction is not sufficient to achieve the required density of the final product. In such cases, it is necessary to resort to the considerably more complex and expensive hot iso-static pressing (HIP) sintering techniques.
Tekna’s unique induction plasma patent pending technology is based on the in-flight plasma melting of the powder material to be used for the production of the sputtering target in an inductively coupled radio frequency plasma torch followed by the deposition of the molten material droplets at high temperature to achieve the thickness and apparent density required by the industry. The technique can be applied to a wide range of sputtering and X-ray target materials including metals, such as Ti, Ni, Al, Cu, Ag, Palladium, refractory metals such as tungsten, tantalum, & molybdenum, other alloys such as Fe/Co & Ni/Co, and intermetallics such as MoSi2.

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