The Bergquist Company developed the Gap Pad thermal interface material family to meet the electronics industry's growing need for interface materials with greater conformability, higher thermal performance and easier application.
Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. Gap Pad provides:
- Elimination of air gaps to reduce thermal resistance.
- High conformability to reduce inter facial resistance.
- Low-stress vibration dampening.
- Compatible with automated dispensing equipment.