shorts, opens, missing component, non-wetting, billboards, tombstones, lifted leads, solder ball, voiding, insufficient solder, reversed tantalum capacitor, excess solder.
- dynamic scan path technology
- hybrid auto focus technology for accuracy and repeatability
- progressive alignment technology
- state of art camera that is fastest in the market with embedded image Processing capability
- mircofocus x-ray source
- innovated algorithm that is flexible and reliable
Value added features:
- window 7 os offers a user experience which makes it easier to visualize and work with your information, and it provides a smoother , more stable gui environment
- offline programming sw
- virtual live image for troubleshooting
- adjustable image quality tools
- component library
maximum detectable product dimensions:457mm x 609mm
typical image acquisition rate : 32. 3cm²/sec.