
YESTech's advanced Thin Camera™ technology offers off-line benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Programming the B3 is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The B3 utilizes a standard package library to simplify training and insure program portability across manufacturing lines. Programs created with the B3 are also compatible with YESTech's complete line of AOI systems.
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| Yestech'S Range Of In-Line Aoi Systems | High Resolution X-ray System | Ytx - X1 X-Ray - In Line | Yestech'S Range Of In-Line Aoi Systems |



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